Bonded Member Manufacturing Apparatus and Method of Manufacturing Bonded Member

ABSTRACT

To prevent misalignment between substrates and distortion of surface, and to keep film thickness uniformity of thin substrate when two substrates are bonded for bonded member, bonded member manufacturing apparatus of bonding first substrate and second substrate, comprising resin film forming means for forming liquid state resin film on the first substrate, semi-curing means for maintaining outer peripheral section of resin film in uncured state and curing inner section surrounded with outer peripheral section in semi-cured state, and substrate bonding means for bonding first substrate and second substrate by bringing second substrate into contact with resin film, such that one end of outer peripheral section is determined as starting point of contact so that boundary line between contact portion and noncontact portion moves in one direction from starting point to opposite end of outer peripheral section while applying pressing force to second substrate.

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to a manufacturing apparatus of a bondedmember and a manufacturing method of a bonded member. More particularly,the present invention relates to a manufacturing apparatus of a bondedmember and a manufacturing method of a bonded member for bonding twosubstrates as the bonded members together adjusting a curing state of aresin film.

2. Related Art

Conventionally, when manufacturing the bonded member, particularly anoptical device with the substrate in non-circular shape such as a liquidcrystal panel, resin has been applied in a so-called fishbone shape, andthe substrates have been bonded together. In other words, bonding hasbeen conducted by applying the resin that becomes a major section arounda center of one substrate, applying the resin as plural guidancesections branching from the major section toward the outer periphery ofthe substrate, placing the one substrate to face to the other substrate,and gradually moving the substrates close to each other to spread theapplied resin over the entire substrate. (See Patent Documents 1 and 2)

FIG. 18 schematically shows a conventional bonding method. In bonding ofcomparatively thick substrates 11E and 12E, when the substrates areprovisionally bonded by irradiating ultraviolet light from cutoutsections 17E at four corners of the holding means 41E with anultraviolet irradiation means 31E in a state where one substrate 12E isheld with a holding means 41E, the initial state of two combinedsubstrates 11E and 12E could be maintained even if the held state iscancelled after bonding.

[Patent Document 1]

-   -   Japanese Patent Application Publication No. 2011-22508

[Patent Document 2]

-   -   Japanese Patent Application Publication No. 2011-67802

However, if at least one of the two substrates is thin, it has beendifficult to maintain uniform film thickness after bonding. For example,due to the shape of a holding surface or the presence of absorptionholes of the holding means, distortion occurs on a surface of thefilm-like substrate, and the uniformity of the film thickness is largelyaffected.

The following problems arise when the film-like thin substrate isprovisionally bonded by the irradiation of the ultraviolet light fromthe cutout sections 17E at four corners of the holding means 41E withthe ultraviolet irradiation means 31E in a state where the film-likethin substrate is held in the holding means 41E by the conventionalholding means. In other words, the light incident from a space betweenan end of the holding means 41E and the substrate 11E into the inside ofthe substrate is dispersed between the holding means 41E and thesubstrate 11E, or the area where the ultraviolet light is blocked andthe area where the ultraviolet light is irradiated are produced, andtherefore the differences in amount of irradiation of the ultravioletlight arise, and nonuniform curing occurs on a resin film 13E. Thus,there has been a problem that the distortion (undulation) occurs on thesurface of the film-like substrate and the uniform film thickness cannotbe maintained.

In a curing process of the resin film after bonding, if the holdingmeans 41E holding the film-like substrate could be removed and thefilm-like substrate could be cured without being held, the holdingmember 41E might not be an obstacle, and the resin film 13E could beuniformly cured. However, there has been a problem that when the holdingmember 41E is removed from the film-like substrate, the film-likesubstrate combined at an optimum position on the substrate 11E becomesmisaligned.

In addition, when a relative misalignment is present between thesubstrates, or when the distortion (undulation) occurs on the surface ofthe film-like substrate and the film thickness becomes nonuniform, itresults in significant reduction of visibility and in disfigurement.Furthermore, in a case where a touch panel as the film-like substrate isbonded to the substrate, the sensitivity of a touch sensor becomesnon-uniform.

The object of the present invention is to prevent the relativemisalignment from occurring between the substrates, to prevent thedistortion (undulation) from occurring on the surface of the thinsubstrate, and to achieve the uniformity in the film thickness in a casewhere one of the substrates is a thin substrate when two substrates arebonded together to produce the bonded member.

SUMMARY OF THE INVENTION

To achieve the above object, a bonded member manufacturing apparatus 10according to Aspect (1) of the present invention is, as shown in FIG. 1for example (see FIG. 3 for each component), a bonded membermanufacturing apparatus 10 for bonding a first substrate 11 and a secondsubstrate 12 together, comprising: a resin film forming means 20 forforming a liquid state resin film 13 on the first substrate 11; asemi-curing means 30 for maintaining an outer peripheral section 14 ofthe resin film 13 formed with the resin film forming means 20 in anuncured state and curing an inner section 15 surrounded with the outerperipheral section 14 in a semi-cured state; and a substrate bondingmeans 40 for bonding the first substrate 11 and the second substrate 12together by bringing the second substrate 12 into contact with the resinfilm 13 wherein the outer peripheral section 14 is in the uncured stateand the inner section 15 is in the semi-cured state, such that one endof the outer peripheral section 14 is determined as a starting point 16of the contact so that a boundary line between a contact portion and anoncontact portion moves in one direction from the starting point 16 toan opposite end of the outer peripheral section while applying pressingforce to the second substrate, the contact portion being alreadycontacted and the noncontact portion being not yet contacted in aprocess of bringing the second substrate 12 into contact with the resinfilm.

Herein, the bonded member means a product in which two or more membersare bonded together with a bonding agent (adhesive). Therefore, thebonded member manufacturing apparatus means an apparatus that bonds twoor more members by using the bonding agent. In this specification, acase of bonding the first substrate 11 and the second substrate 12 ishandled. Although any substrates can be selected as the first substrate11 and the second substrate 12, an example in which the first substrate11 is a substrate for an optical device such as a liquid crystal paneland the second substrate 12 is a transparent thin substrate such as aprotective film is handled as a typical example. Although the shape ofthe substrate is generally like a rectangular flat plate, the shape isnot limited to the rectangular shape but can be any shapes such as acircular shape and a heart shape, and not limited to the flat plate butmay be slightly curved or concave or convex, or may have depressions,and changes in thickness, and the substrate may be constructed with aflexible material. The outer peripheral section 14 of the resin film 13means a region in a specified width from an outer periphery when theresin film 13 applied on the first substrate 11 is viewed from thenormal direction of the first substrate 11. Although the specified widthcan be determined appropriately, herein, because a bulged portion incomparison with the other portion is formed in the outer periphery atthe time of application of the resin in the liquid state, the width mayapproximately be agreed with such the width that the bulged portion isformed or slightly larger than the width (for example, as large as ortwice as large as the width). The inner section 15 means the areasurrounded with the outer peripheral section 14 of the resin film 13that is applied on the first substrate.

Regarding the cured (hardened) state of the resin film 13, the statewhere the film has sufficient hardness as a product is referred to as afully cured state, and the semi-cured state means the state where curedegree is lower than that in the fully cured state and adhesiveness tothe second substrate 12 remains. The semi-cured state also means thestate where the modulus of elasticity (stress/distortion) is lower thanthat in the fully cured state. The uncured state means the state wherecure treatment (ultraviolet irradiation) is not conducted or the statewhere, even if the cure treatment is conducted, it is not sufficient andthe liquid state is maintained, that is, the state where the flowabilityis maintained.

According to the configuration of the present aspect, even if one of thesubstrates is a thin substrate when two substrates are bonded togetherto produce the bonded member, the manufacturing apparatus 10 of thebonded member can be provided such that (1) since the inner section 15of the resin film 13 is semi-cured, thereby the viscosity of the resinincreases, and because one substrate is provisionally bonded to theother substrate when one substrate is bonded to the other substrate, therelative misalignment can be prevented from occurring between thesubstrates, (2) a distortion (undulation) can be prevented fromoccurring on a surface of the thin substrate, and the uniformity in thefilm thickness can be achieved.

The bonded member manufacturing apparatus 10 according to Aspect (2) isa manufacturing apparatus of Aspect (1), as shown in FIG. 1 and FIG. 3for example, wherein the semi-curing means 30 has an ultravioletirradiation means 31 for irradiating ultraviolet light to cure the resinfilm 13, and a light blocking means 32 for blocking the ultravioletlight by the ultraviolet irradiation means 31 to be irradiated to theouter peripheral section 14 of the resin film 13 formed with the resinfilm forming means 20.

The light blocking means 32 is preferably a shielding means that shieldsthe outer peripheral section 14 from the irradiation of the ultravioletlight by the ultraviolet irradiation means 31.

According to the configuration of this Aspect, by irradiating theultraviolet light using the light blocking means 32, the resin film 13formed on the first substrate 11 can be reliably maintained with theouter peripheral section 14 in the uncured state and with the innersection 15 cured in semi-cured state. In addition, for example, bycontrolling the time of the ultraviolet irradiation or the intensity ofthe ultraviolet light, the semi-cured state can be properly adjusted.

The bonded member manufacturing apparatus 10 according to Aspect (3) isa manufacturing apparatus of Aspect (1) or Aspect (2), as shown in FIG.5 for example, wherein the second substrate 12 is a transparent polymerfilm; and the substrate bonding means 40 has a mounting means 21 formounting the first substrate 11 thereon and a roller means 42 forrolling on the second substrate 12 from one end side to another end sideof the outer peripheral section 14 while pressing the second substrate12 toward the first substrate 11, and thereby bonding the secondsubstrate 12 to the first substrate 11.

Herein, the polymer film as the second substrate 12 is required to havetransparency, and various characteristics are required, depending on theoptical device that constructs the first substrate 11. The polymer filmhas, in addition to a transparency, a protective function that protectsthe surface of the liquid crystal panel from contamination in a casewhere the first substrate 11 is an optical device such as the liquidcrystal panel. Besides, a polycarbonate (PC) film to be used for opticalcompensation is preferable in a case of use in a mobile phone, and acycloolefin (COP) film is preferable in a case of use in a touch panel.In this specification, a distinction is made between the mounting means21 that the first substrate 11 is mounted on and a holding means 41 (seeAspect 4) that holds the second substrate 12, but the mounting means 21may also have a vacuum suction hole or a claw for holding, and theholding means 41 may merely mounts the substrate thereon.

According to the configuration of this Aspect, when the second substrate12 is bonded to the resin film 13 applied on the first substrate 11, theroller means 42 is used to the resin film 13 in which the inner section15 is cured in the semi-cured state, and therefore the relativemisalignment can be prevented from occurring between the substrates, thedistortion (undulation) can be prevented from occurring on the surfaceof the thin substrate and the smoothness can be maintained. Theuniformity in the film thickness can also be achieved. In addition,there is an advantage that air bubbles are hardly trapped between thesecond substrate 12 and the resin film 13.

The manufacturing apparatus 10A according to Aspect (4) is amanufacturing apparatus of Aspect (1) or Aspect (2), as shown in FIG. 8and FIG. 9 for example, wherein the substrate bonding means 40A has amounting means 21 for mounting the first substrate 11 thereon, a holdingmeans 41 for holding the second substrate 12, and a rotating means 43for rotating the holding means 41, the rotating means being coupled withthe holding means 41; and a controller 50 for controlling spacingbetween the mounting means 21 and the holding means 41 and forcontrolling the rotating means 43 to allow the second substrate 12 heldwith the holding means 41 to be brought into contact with the resin film13 wherein the outer peripheral section 14 is maintained in the uncuredstate and the inner section 15 is cured into the semi-cured state suchthat the one end of the outer peripheral section 14 is determined as thestarting point 16, and the boundary line between the contact portion andthe noncontact portion moves in the one direction from the startingpoint 16 to the opposite end while the pressing force is applied.

According to the configuration of this Aspect, since the secondsubstrate 12 is held with the holding means 41 and rotated to be broughtinto contact with the resin film on the first substrate 11, thesubstrate bonding step can be easily automated. In addition, the programmanipulation of the substrate bonding step can be achieved, and in thiscase, while the spacing between the mounting means 21 and the holdingmeans 41 is being adjusted, the rotating means 43 is controlled, andtherefore the boundary line between the contact portion and thenoncontact portion can be moved in one direction.

The manufacturing apparatus 10D according to Aspect (5) is amanufacturing apparatus of Aspect (4), as shown in FIG. 16 and FIG. 17for example, further comprising: a substrate thickness measuring means70 for measuring a thickness of the substrate; wherein the substratebonding means 40 is for adjusting the spacing between the mounting means21 and the holding means 41, based on thickness data of at least eitherone of the first substrate 11 and the second substrate 12 obtained bythe substrate thickness measuring means 70.

According to the configuration of this Aspect, the thickness of thefirst substrate or the second substrate can be obtained in advance withthe substrate thickness measuring means 70, and therefore the height ofthe mounting means 21 or the holding means 41 can be adjusted at thesubstrate bonding.

The manufacturing apparatus 10C according to Aspect (6) is amanufacturing apparatus of Aspect (1) or Aspect (2), as shown in FIG. 14and FIG. 15 for example, wherein the resin film forming means 20 has aslit coater 22 to feed a resin in the liquid state from a resin feedingslit and to apply the liquid state resin film 13 on the first substrate11, the resin feeding slit being disposed in parallel with a surface ofthe first substrate 11, the surface being for forming the resin filmthereon, the slit coater being movable perpendicularly to the resinfeeding slit and movable in parallel with the surface of the firstsubstrate 11, and applies the liquid state resin film 13 on the firstsubstrate 11, the semi-curing means 30 has the ultraviolet irradiationmeans 31 for irradiating the ultraviolet light to the liquid state resinfilm 13 formed on the first substrate 11 with the resin film formingmeans 20, and the ultraviolet irradiation means 31 has an ultravioletirradiation slit disposed in a parallel direction with the resin feedingslit, the ultraviolet irradiation means being constructed integrally incombination with the slit coater 22, the ultraviolet irradiation slitbeing formed shorter by a specified length in a longitudinal directionbetween both ends than the resin feeding slit.

Herein, the specified length is generally the width of the outerperipheral section 14 at one end, and the sum at both ends is the doubleof the width of the outer peripheral section 14 in length. According tothe configuration of the present Aspect, since the slit coater 22 andthe ultraviolet irradiation means 31 are integrally formed incombination, the ultraviolet light is automatically irradiated after theelapse of a certain period of time after dropping the liquid state resin13. In addition, since the length of the ultraviolet irradiation slit inthe longitudinal direction between both ends is formed shorter by aspecified length than the length of the resin feeding slit in thelongitudinal direction, unirradiated region, that is, uncured region isautomatically formed in the outer peripheral section 14 without theshielding means. Typically, the specified time is the value calculatedby division, that the spacing between the resin feeding slit and theultraviolet irradiation slit plus the width of the outer peripheralsection 14 is divided by the scanning speed.

To achieve the above object, a bonded member manufacturing methodaccording to Aspect (7) of the present invention is, as shown in FIG. 2for example (see FIG. 3 for each component), a manufacturing methodwherein a first substrate 11 and a second substrate 12 are bondedtogether, comprising: a resin film forming step (Step 2) of forming aliquid state resin film 13 on the first substrate 11; a semi-curing step(Step 4) of maintaining an outer peripheral section 14 of the resin film13 formed through the resin film forming step (Step 2) in an uncuredstate and curing an inner section 15 surrounded by the outer peripheralsection 14 in a semi-cured state; and a substrate bonding step (Step 6)of bonding the first substrate 11 and the second substrate 12 togetherby bringing the second substrate 12 into contact with the resin film 13wherein the outer peripheral section 14 is in the uncured state and theinner section 15 is in the semi-cured state, such that one end of theouter peripheral section 14 is determined as a starting point 16 of thecontact so that a boundary line between a contact portion and anoncontact portion moves in one direction from the starting point 16 toan opposite end of the outer peripheral section while applying pressingforce to the second substrate, the contact portion being alreadycontacted and the noncontact portion being not yet contacted in bringingthe second substrate 12 into contact with the resin film.

According to the configuration of this Aspect, even if one of thesubstrates is a thin substrate when two substrates are bonded togetherto produce the bonded member, the manufacturing method of the bondedmember can be provided such that (1) since the inner section 15 of theresin film 13 is semi-cured, thereby the viscosity of the resinincreases, and because one substrate is provisionally bonded to theother substrate when the one substrate is bonded to the other substrate,the relative misalignment can be prevented from occurring between thesubstrates, (2) a distortion (undulation) can be prevented fromoccurring on a surface of the thin substrate, and the uniformity in thefilm thickness can be achieved.

The manufacturing method according to Aspect (8) is a manufacturingmethod of Aspect (7), as shown in FIG. 2 and FIG. 3 for example, whereinthe semi-curing step (Step 4) has an ultraviolet irradiation step (Step4-1) of irradiating ultraviolet light to cure the resin film 13, and alight blocking step of blocking the ultraviolet light to be irradiatedby the ultraviolet irradiation step (Step 4-1) to the outer peripheralsection 14 of the resin film 13 formed through the resin film formingstep (Step 2).

The light blocking step may preferably be a shielding step (Step 4-2)that shields the outer peripheral section 14 from the irradiation of theultraviolet light by the ultraviolet irradiation step (Step 4-1)(typically, the outer peripheral section 14 is covered with theshielding member 32 (STEP 3), to be shielded from the ultraviolet lightirradiated thereto).

According to the configuration of the Aspect, by blocking the lightthrough the light blocking step, typically, by shielding the irradiationof the ultraviolet light, the resin film 13 formed on the firstsubstrate 11 can be reliably maintained with the outer peripheralsection 14 in the uncured state and the inner section 15 cured insemi-cured state. In addition, by controlling the time of theultraviolet irradiation or the intensity of the ultraviolet light, thesemi-cured state can be adjusted properly.

The manufacturing method according to Aspect (9), is a manufacturingmethod of Aspect (7) or Aspect (8), as shown in FIG. 5 for example,wherein the second substrate 12 is a transparent polymer film, and inthe substrate bonding step (Step 6), the second substrate 12 is pressedtoward the first substrate 11 with a roller means 42, the roller means42 is rolled from the one end side to the other end side of the outerperipheral section 14, and thereby the first substrate 11 is bonded tothe second substrate 12.

According to the configuration of the Aspect, when the second substrate12 is bonded to the resin film 13 applied on the first substrate 11, theroller means 42 is used to the resin film 13 in which the inner section15 is cured in the semi-cured state, and therefore the relativemisalignment can be prevented from occurring between the substrates, thedistortion (undulation) can be prevented from occurring on the surfaceof the thin substrate and the smoothness can be maintained. Theuniformity in the film thickness can also be achieved. In addition,there is an advantage that air bubbles are hardly trapped between thesecond substrate 12 and the resin film 13.

The manufacturing method according to Aspect (10), is a manufacturingmethod of any one of Aspects (7) to (9), as shown in FIG. 9 for example,wherein in the substrate bonding step (Step 6), a mounting means 21 formounting the first substrate 11 thereon, a holding means 41 for holdingthe second substrate 12, and a rotating means 43 for rotating theholding means 41, the rotating means being coupled with the holdingmeans 41 are used, the substrate bonding step (Step 6) includes a stepof controlling the spacing between the mounting means 21 and the holdingmeans 41 and also controlling the rotating means 43 to allow the secondsubstrate 12 held with the holding means 41 to be brought into contactwith the resin film 13 wherein the outer peripheral section 14 ismaintained in the uncured state and the inner section 15 is cured intothe semi-cured state such that one end of the outer peripheral section14 is determined as the starting point 16 of the contact so that theboundary line between a contact portion and a noncontact portion movesin one direction from the starting point 16 to an opposite end of theouter peripheral section 14 while applying pressing force to the secondsubstrate, the contact portion being already contacted and thenoncontact portion being not yet contacted in a process of bringing thesecond substrate 12 into contact with the resin film.

According to the configuration of the Aspect, since the second substrate12 is held with the holding means 41 and rotated to be brought intocontact with the resin film 13 on the first substrate 11, the substratebonding step (Step 6) can be easily automated. In addition, the programmanipulation of the substrate bonding step (Step 6) can be achieved, andin this case, the rotating means 43 is controlled while the spacingbetween the mounting means 21 and the holding means 41 is adjusted, andtherefore the boundary line between the contact portion and thenoncontact portion can be moved in one direction.

According to the present embodiments, the relative misalignment can beprevented from occurring between the substrates, the distortion(undulation) can be prevented from occurring on the surface of the thinsubstrate, and the uniformity in the film thickness can be achieved,even if one of the substrates is a thin substrate when two substratesare bonded together to produce the bonded member.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram that illustrates a configuration example of amanufacturing apparatus of bonded member in Embodiment 1;

FIG. 2 is a flow chart showing an example of steps of manufacturingmethod of the bonded member in Embodiment 1;

FIG. 3 is a view that illustrates a process in each section of themanufacturing apparatus of the bonded member in Embodiment 1;

FIG. 4A shows a perspective view that schematically indicates thedistribution of film thickness of a resin film in liquid state which isformed through a resin film forming step;

FIG. 4B shows a view that schematically indicates the distribution offilm thickness of a resin film in liquid state which is formed through aresin film forming step;

FIG. 4C shows a view that schematically indicates the distribution offilm thickness of a resin film in liquid state which is formed through aresin film forming step;

FIG. 5 shows views that illustrate an example of substrate bonding stepsof the bonded member in Embodiment 1;

FIG. 6 is a view that illustrates an example of a holding means inEmbodiment 1;

FIG. 7 is a view that schematically illustrates a substrate bondingmeans in Embodiment 2;

FIG. 8 is a block diagram that illustrates a configuration example of amanufacturing apparatus of a bonded member in Embodiment 3;

FIG. 9 shows views that illustrate an example of substrate bonding stepsin Embodiment 3;

FIG. 10 is a view that illustrates an appearance when a substrate filmcomes into contact with the resin film;

FIG. 11A shows a view that illustrates an example in which the holdingmeans holds a second substrate in a curved shape;

FIG. 11B shows a view following FIG. 11A that illustrates an example inwhich the holding means holds a second substrate in a curved shape;

FIG. 11C shows a view following FIG. 11B that illustrates an example inwhich the holding means holds a second substrate in a curved shape;

FIG. 12 is a block diagram that illustrates a configuration example of amanufacturing apparatus of a bonded member in Embodiment 5;

FIG. 13 is a view that illustrates an example in which an electric fieldis applied between a first substrate and a second substrate;

FIG. 14 is a block diagram that illustrates a configuration example of amanufacturing apparatus of a bonded member in Embodiment 6;

FIG. 15 is a view that illustrates an example in which a slit coater asan application means and an ultraviolet irradiation means are integrallyformed in combination;

FIG. 16 is a block diagram that illustrates a configuration example of amanufacturing apparatus of a bonded member in Embodiment 7;

FIG. 17 is a view that illustrates an example of measuring the thicknessof the first substrate; and

FIG. 18 is a view that schematically shows a conventional bondingmethod.

This application is based on the Patent Applications No. 2011-218643filed on Sep. 30, 2011 in Japan, the contents of which are herebyincorporated in its entirety by reference into the present application,as part thereof.

The present invention will become more fully understood from thedetailed description given hereinbelow. Further range of application ofthe present invention will become more clear from the detaileddescription given hereinbelow. However, the detailed description and thespecific embodiment are illustrated of desired embodiments of thepresent invention and are described only for the purpose of explanation.Various changes and modifications will be apparent to those ordinaryskilled in the art on the basis of the detailed description.

The applicant has no intention to give to public any disclosedembodiments. Among the disclosed changes and modifications, those whichmay not literally fall within the scope of the patent claims constitute,therefore, a part of the present invention in the sense of doctrine ofequivalents.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, embodiments of the present invention will be described withreference to the drawings. In the drawings, the sections identical withor corresponding to each other are denoted by the same referencenumeral, and the redundant description is not repeated.

Embodiment 1

Embodiment 1 is described such that, in an example in which anultraviolet shielding means as a light blocking means is used tomaintain an outer peripheral section of the resin film in an uncuredstate and cure an inner section in a semi-cured state, a first substrateis mounted on a mounting means, while a roller means is used to press asecond substrate toward the first substrate, the roller means is rolledfrom one end section to the other end section of the outer peripheralsection, and therefore the second substrate is bonded to the firstsubstrate.

FIG. 1 shows a configuration example of a manufacturing apparatus 10 ofa bonded member in Embodiment 1. FIG. 3 and FIG. 5 should be referred tofor each part of the manufacturing apparatus 10 of the bonded member. InFIG. 1, the manufacturing apparatus 10 of the bonded member is anapparatus for bonding the first substrate 11 and the second substrate 12together. The manufacturing apparatus 10 of the bonded member isprovided with a resin film forming means 20 that forms a liquid stateresin film 13 on the first substrate 11, a semi-curing means 30 thatmaintains an outer peripheral section 14 of the resin film 13 formedwith the resin film forming means 20 in an uncured state and cures aninner section 15 surrounded with the outer peripheral section 14 in asemi-cured state, and a substrate bonding means 40 that brings thesecond substrate 12 into contact with the resin film 13 and bonds thefirst substrate 11 and the second substrate 12 together while applyingpressing force. Here, the outer peripheral section 14 of the resin film13 is in the uncured state and its inner section 15 is in the semi-curedstate when the second substrate 12 is brought into contact with it.Bonding can be conducted such that, for example, one end of the outerperipheral section 14 of the resin film 13 is set as a starting point16, the second substrate is brought into contact with the resin film sothat a boundary line between a contact portion and a noncontact portionmoves from the starting point 16 to the opposite end in one directionwhile the pressing force is applied, and the second substrate is bondedto the first substrate.

The description is made of an example where the first substrate 11 is anoptical device such as liquid crystal panel and the second substrate 12is a film-like thin substrate. The second substrate 12 may be atransparent film that protects the optical device from contamination,and preferably for example a polycarbonate (PC) film that is used foroptical compensation in a case of being used in a mobile phone and acycloolefin (COP) film in a case of being used in a touch panel. Theresin film 13 is used as a bonding agent (adhesive) that bonds the firstsubstrate 11 and the second substrate 12 together. A transparent,adhesive, ultraviolet curable polymeric resin can be used for the resinfilm 13, and modified acrylate having a main chain of epoxy, polyester,or urethane, for example, can be used. The resin film 13 (bonding agent)is in a liquid state during application, cured with ultravioletirradiation, and loses its flowability.

Regarding the cured state of the resin film 13, the state where the filmhas sufficient hardness as a product is referred to as a fully curedstate, and the semi-cured state means the state where cure degree islower than that in the fully cured state and adhesiveness to the secondsubstrate 12 remains. The semi-cured state also means the state wherethe modulus of elasticity (stress/distortion) is lower than that in thefully cured state. The uncured state means the state where curetreatment (ultraviolet irradiation) is not conducted or the state where,even if the cure treatment is conducted, it is not sufficient and theliquid state is maintained, that is, the state where the flowability ismaintained and its viscosity is lower than that in the semi-cured state.

The resin film forming means 20 has a mounting means 21 that the firstsubstrate 11 is mounted on, an application means 22 that applies resinas the bonding agent 13 onto the first substrate 11, and a scanningmeans 23 that scans (moves) the application means 22 with respect to themounting means 21. In this Embodiment, a table is used as the mountingmeans 21, and the example in which the first substrate 11 ishorizontally held on the table 21 with the bonding surface directedupward is described. The direction of the bonding surface of thesubstrate is, however, not limited to the horizontal direction, but maybe directed to any direction, and may be directed downward (see FIG. 7).Furthermore, in this Embodiment, the substrate is held with vacuumsuction. Edges of the substrate may be, however, grasped so as to becaught with claws instead of the vacuum suction, or the substrate may beheld with static electricity or an adhesive with weak adhesive force.

In this Embodiment, as the application means 22, the slit coater thatfeeds the resin in the liquid state from a resin feeding slit parallelto the surface of the first substrate 11 is used, and the scanningdirection of the scanning means 23 is determined to the directionparallel to the surface of the first substrate 11 and perpendicular tothe resin feeding slit. By dropping of liquid state resin from the slitcoater 22 to a linear region on the first substrate 11 immediately belowthe slit coater and scanning the slit coater 22 with the scanning means23, the resin film 13 in the liquid state is formed on the surface ofthe first substrate 11. The thickness of the resin film 13 is, forexample, about 50 through 200 μm. The resin film 13 tends to bulge inthe outer peripheral section 14 in comparison with the inner section 15.Such phenomenon can be considered due to the action of the flowabilityand surface tension of the resin film 13. The slit coater 22 isappropriately fed with the resin from a resin container (not shown) thatis disposed above the slit coater 22. As an alternative to the slitcoater 22, a nozzle (including multiple nozzles) may drop the liquidstate resin, and the scanning direction by the scanning means 23 may bedetermined to two directions that are in parallel with the surface ofthe first substrate 11 and perpendicular to each other. However, theslit coater 22 has the advantage of quickly applying the resin in thinfilm.

The semi-curing means 30 has an ultraviolet irradiation means 31 thatirradiates ultraviolet light for curing the resin film 13, and a lightblocking means 32 that blocks the ultraviolet light by the ultravioletirradiation means 31 from entering into the outer peripheral section 14of the resin film 13 formed with the resin film forming means 20. Inthis Embodiment, as the light blocking means 32, a shielding means thatshields the outer peripheral section 14 from the irradiation of theultraviolet light by the ultraviolet irradiation means 31 is used.

As the ultraviolet irradiation means 31, for example, an ultraviolet(UV) lamp or an ultraviolet light-emitting diode (UVLED) lamp that canirradiate the entire surface of the first substrate 11 can be used. Asthe shielding means 32, such a frame-like blocking plate that allows theultraviolet light to pass within the frame and block the ultravioletlight at the portion of the frame can be used. For example, a metalframe with its inner part removed may be used, and a glass plate inwhich the frame is formed with an ultraviolet blocking filter containingzinc oxide and the like may be used. By blocking with the frame portionthe ultraviolet light from the ultraviolet irradiation means 31, theouter peripheral section 14 of the resin film 13 formed with the resinfilm forming means 20 can be maintained in the uncured state, and theinner section 15 surrounded by the outer peripheral section 14 can becured in the semi-cured state.

In this state, the inner section 15 comes into the semi-cured state, andthus the flowability is lost, but adherence remains, and when the innersection 15 comes into contact with the second substrate 12, the innersection 15 can be bonded to the second substrate 12. In addition, theinner section 15 is cured from the liquid state in which the surface isflat, and thus the inner section 15 comes into the semi-cured state withmaintaining flatness of the surface and the uniformity of the filmthickness. Therefore, the viscosity of the inner section 15 of the resinfilm 13 formed on the first substrate 11 increases, and when the secondsubstrate 12 is going to be bonded to the first substrate 11, the secondsubstrate 12 is fixed and provisionally bonded on the first substrate 11without drifting of the relative position to the first substrate 11. Inaddition, because the second substrate 12 is provisionally bonded to thefirst substrate 11, even after the pressing force by a holding means 41or a roller means 42 is eliminated, the second substrate 12 is notdisplaced from the first substrate 11. Thus, because the secondsubstrate 12 is not required to be held, there is no means thatconstitutes an obstacle to the ultraviolet irradiation, and theultraviolet light can be uniformly irradiated to the inner section 15 ofthe resin film 13, the distortion (undulation) can be prevented fromoccurring on the surface of the second substrate 12. The outerperipheral section 14 of the resin film 13 remains in the uncured state.

The substrate bonding means 40 has the mounting means 21 that the firstsubstrate 11 is mounted on and a roller means 42 that while pressing thesecond substrate 12 toward the first substrate 11, rolls from one endside to the other end side of the outer peripheral section 14, and thusbonds the second substrate 12 to the first substrate 11. In use of theroller means 42, the mounting means 21 of the resin film forming means20 can be used in common as the mounting means 21 that the firstsubstrate 11 is mounted on. With respect to the roller means 42, thetable 21 is constructed to be relatively movable to a perpendiculardirection to a shaft of the roller means 42 in a horizontal plane andmoved, and therefore the roller means 42 rotates.

When the second substrate 12 is brought into contact with one end sideof the outer peripheral section 14 by the roller means 42, the secondsubstrate 12 comes into contact with the bulged portion of the resin inthe outer peripheral section 14, and the contact portion spreads fromthe outside to the inside. Then, the uncured portion that is bulgedmoves toward the inner section 15 and is eventually pressed against thesecond substrate 12, and the thickness of the resin film becomes thesame in the outer peripheral section 14 and the inner section 15.Accordingly, one end of the outer peripheral section 14 is determined asthe starting point 16, and the second substrate is brought into contactwith the resin film 13 on the first substrate 11 so that a boundary linebetween a contact portion and a noncontact portion moves from thestarting point 16 to the opposite end in one direction while thepressing force is applied on the second substrate 12. The contactportion of the resin film 13 gradually spreads and eventually reachesthe outer peripheral section opposite to the starting point 16. At thisportion, the resin is in the uncured state, and therefore a part of theresin flows, and the second substrate 12 is uniformly pressed andbecomes flattened against the first substrate 11 through the resin film13. When the roller means 42 passes across the second substrate 12 fromone end to the other end, the second substrate 12 is bonded to the firstsubstrate 11 through the resin film 13 and remains on the side of thefirst substrate 11. Then, the second substrate 12 is fixed andprovisionally bonded on the first substrate 11 without drifting of therelative position to the first substrate 11. In addition, a flatinterface is formed between the second substrate 12 and the resin film13, and the bonded member that has no or very small distortion(undulation) on the surface of the second substrate 12 is formed.

The controller 50 controls the entire manufacturing apparatus 10 of thebonded member and each component thereof and provides the functions asthe manufacturing apparatus 10 of the bonded member.

FIG. 2 shows a process flow example of the manufacturing method of thebonded member. Furthermore, FIG. 3 illustrates a process in each sectionof the manufacturing apparatus 10 of the bonded member (hereinafter,merely referred to as the “manufacturing apparatus”) in association withthe process flow.

First, the first substrate 11 is mounted on the mounting means 21 of themanufacturing apparatus 10 (Substrate mounting step: (a), Step 1). Thefirst substrate 11 is, for example, a liquid crystal panel (hereinafter,the first substrate 11 is merely referred to as a “substrate”). Thethickness of the substrate 11 is the order of 0.3 to 2 mm. Next, liquidresin is applied on the substrate 11 with the application means 22, andthe resin film 13 in the liquid state is formed on the substrate 11(resin film forming step: (b), Step 2). In this Embodiment, the slitcoater is used as the application means 22, and the resin film 13 isformed to achieve specified film thickness. The specified film thicknessis 50 to 200 μm. Other application means 22 can be used as analternative to the slit coater. For example, the liquid resin that isapplied linearly through a discharge nozzle can be leveled by a brushand the like to achieve the specified thickness to form the resin film.

FIG. 4A, FIG. 4B and FIG. 4C schematically show the distribution of filmthickness of the resin film 13 in liquid state which is formed throughthe resin film forming step (Step 1). FIG. 4A shows the direction ofapplication of the resin film 13 on the first substrate 11, and FIG. 4Band FIG. 4C respectively show the distribution of film thickness of theresin film 13 in an X-direction and a Y-direction. As shown in FIG. 4Band FIG. 4C, the outer peripheral sections 14 at four sides tend tobulge in comparison with the inner section 15. Therefore, when thefilm-like second substrate 12 (hereinafter, the second substrate isreferred to as a “substrate film”) is bonded in this state, the resinfilm thickness cannot be made uniform, and air bubbles may be trappedduring the bonding process. Thus, this embodiment adopts the followingmeans and processes.

Going back to FIG. 2 and FIG. 3, the description is continued. First, ashielding means 32 that covers the outer peripheral sections 14 at fourside of the resin film 13 formed on the substrate 11 is disposed abovethe resin film 13 ((c), Step 3). The outer peripheral sections 14 atfour side of the resin film 13 formed on the substrate 11 are coveredwith the shielding means 32, and the ultraviolet light is irradiatedfrom above with the ultraviolet irradiation means 31 (Semi-curing step:(d), Step 4). Since the outer peripheral sections 14 at four sides ofthe resin film 13 are shielded with the shielding means 32, the outerperipheral sections 14 are not irradiated with the ultraviolet light andmaintain the uncured liquid state, and the inner section 15 that is notshielded with the shielding means 32 is semi-cured.

Next, the substrate film 12 is held with the holding means 41 (notshown) (Second substrate holding step: (e), Step 5). The substrate film12 is, for example, a protective film for protecting the display surfaceof the liquid crystal panel 11. The thickness of the substrate film 12is the order of 0.05 to 0.2 mm. For example, the substrate film 12 isheld with the holding means 41 that is flexible and has a convex andcurved surface to the lower side, and the substrate bonding means 40holds one end of the holding means 41 at a specified distance above thesubstrate 11, that is, at a height so as to come into contact with theresin film 13.

Next, in the resin film 13 where the outer peripheral section 14 is inthe uncured state and the inner section 15 is in the semi-cured state,the uncured outer peripheral section 14 is determined as the startingpoint 16, the substrate film 12 is brought into contact with the resinfilm 13, the pressing force applied, and the substrate 11 and thesubstrate film 12 are combined and bonded with each other. In thisEmbodiment, the substrate 11 and the substrate film 12 are bonded byusing the roller means 42, determining one end of the outer peripheralsection 14 as the starting point 16, bringing into contact so that aboundary line between a contact portion and a noncontact portion movesin one direction from the starting point 16 to the opposite end whilethe pressing force is applied (Substrate bonding step: (f), Step 6).

FIG. 5 illustrates an example of substrate bonding step (Step 6) of thebonded member in Embodiment 1. The substrate 11 in which the resin film13 where the outer peripheral section 14 is in the uncured state and theinner section 15 is in the semi-cured state is formed is placed on thetable 21. The outer peripheral sections 14 at four sides of the resinfilm 13 are uncured and in the liquid state, and the inner section 15 isin the semi-cured state and its viscosity is increased in comparisonwith that in the liquid state. In this Embodiment, the substrate 11, theresin film 13, and the substrate film 12 are interposed between thetable 21 and the roller means 42, the roller means 42 is rotated on thesubstrate film 12, and therefore the substrate film 12 is bonded to thesubstrate 11 through the resin film 13.

FIG. 6 illustrates an example of the holding means in Embodiment 1. Bothsides of the substrate film 12 is held by the holding means 41B1 and41B2 through vacuum suction, electrostatic absorption, adhesive withweak adhesion, or mechanical holding (for example, holding clip) beforethe roller means 42 presses. One end of the substrate film 12transferred in an upper portion of the substrate 11 is first broughtinto contact with liquid at the starting point 16 of the bonding as anuncured portion of the resin film 13 by the holding means 41B1. Then,the holding means 41B1 retracts to an original retracting position, andthe substrate film 12 is brought into contact with the resin film 13 byusing the roller means 42 such that one end of the outer peripheralsection 14 is determined as the starting point 16, and the boundary linebetween the contact portion and the noncontact portion moves from thestarting point 16 to the opposite end in one direction while thepressing force is applied, and the substrate film 12 is bonded to thesubstrate 11. At that time, the other end of the substrate film 12 isheld by the holding means 41B2 until the other end of the substrate film12 is bonded to the uncured opposite end of the resin film 13 on thesubstrate 11.

Going back to FIG. 5, the description is continued. As the roller means42 moves on the substrate film 12 from one end to the other end, thesubstrate film 12 is bonded to the substrate 11 (from a to e). In otherwords, after the substrate film 12 is pressed on the substrate 11 by theroller means 42, the substrate film 12 is brought into close contactwith the resin film 13 and bonded to the substrate 11, and after theroller means 42 passes, the bonded member can be obtained.

When the substrate film 12 is brought into contact with one end side ofthe outer peripheral section 14 by the roller means 42, the substratefilm 12 comes into contact with the bulged portion of the resin in theouter peripheral section 14, and the contact portion spreads from theouter peripheral side to the inner side. Then, the uncured portion thatis bulged moves toward the inner section and is eventually pressedagainst the substrate film 12, and the thickness of the resin film 13becomes the same in the outer peripheral section 14 and the innersection 15. Accordingly, one end of the outer peripheral section 14 isdetermined as the starting point 16, the substrate film 12 is broughtinto contact with the resin film 13 on the first substrate 11 so thatthe position is changed from the starting point 16 to the opposite endin one direction while the pressing force is applied on the substratefilm 12. The contact portion of the resin film 13 gradually spreads andeventually reaches the outer peripheral section 14 opposite to thestarting point 16. The position of the holding means 41B2 moves closerto the resin film 13 as the substrate film 12 is bonded to the resinfilm 13. At this portion, there is an uncured state portion, andtherefore a part of the resin flows, and the second substrate 12 isuniformly pressed and becomes flattened against the first substrate 11through the resin film 13. After the roller means 42 passes, a flatinterface is formed between the second substrate 12 and the resin film13 in the entire bonded member. In addition, the relative misalignmentis absent between the substrates, and the bonded member that has no orvery small distortion (undulation) on the surface of the secondsubstrate 12 is formed.

Next, the entire resin film 13 interposed between the substrate 11 andthe substrate film 12 that have been bonded is fully cured with theultraviolet irradiation means 31 ((g), Step 7) (see FIG. 3).Accordingly, the bonded member in which the substrate 11 and thesubstrate film 12 are bonded together using the bonding agent 13 isfinished. For example, the display section of the liquid crystal panelas the first substrate 11 is protected by the substrate film as thesecond substrate 12.

Regarding to the means that conducts complete cure, a device separatefrom a bonding apparatus that conducts the processes from the resin filmforming process to the substrate bonding process (for example,ultraviolet irradiation device) may be used.

As described above, according to the present embodiment, the relativemisalignment can be prevented from occurring between the substrates, thedistortion (undulation) can be prevented from occurring on the surfaceof the thin substrate, and the uniformity in the film thickness can beachieved, even if one of the substrates is a thin substrate when twosubstrates are bonded to produce the bonded member.

That is, in a case where the thin substrate as the film-like substrateis used, the following effects can be obtained. (1) The inner section 15of the resin film 13 is semi-cured with a specified film thicknessexcept for the outer peripheral sections 14 at four sides, the viscosityof the resin 13 is increased, and therefore the substrate film 12 isprovisionally bonded to the substrate 11 when the substrate film 12 isbonded. Therefore, when the holding means 41 that holds the substratefilm 12 is removed, the state where the substrate film 12 is bonded tothe substrate 11 is maintained, and the substrate film 12 is notdisplaced from the substrate 11. (2) The fluctuation of the filmthickness is eliminated in the subsequent production steps, and the filmthickness can be uniformly maintained, and therefore the distortion(undulation) does not occur on the surface of the substrate film 12after bonding the substrate film 12. In addition, even if the undulationoccurred, the undulation would be very small. (3) Because the outerperipheral sections 14 at the four sides of the resin film 13 is in theuncured state, and the outer peripheral section 14 of the resin film 13is determined to be the starting point 16 of the bonding, air bubblesare hardly trapped at the moment when the substrate film 12 comes intocontact with liquid film of the resin film 13. (4) Because the substratefilm 12 is bonded under the uncured state of the outer peripheralsections 14 at the four sides of the resin film 13, the bulged portionof the outer peripheral section 14 becomes flattened, and the entirefilm thickness can be made uniform.

Embodiment 2

In Embodiment 1, an example in which the substrate film 12 is combinedand bonded from above the substrate 11 through the resin film 13 isdescribed. Here, in Embodiment 2, an example is described such that thesurface where the resin film 13 of the substrate 11 is formed is faceddownward, and the substrate film is bonded from below. In comparisonwith Embodiment 1, although the first substrate 11 and the secondsubstrate 12 are placed upside down, the other configurations are thesame. Different points from Embodiment 1 will be principally described.

FIG. 7 schematically illustrates the substrate bonding means inEmbodiment 2. The resin film 13 in which the outer peripheral section 14is in the uncured state and the inner section 15 is in the semi-curedstate is formed on the first substrate (substrate) 11, the substrate isturned upside down, and the substrate 11 where the resin film 13 isformed is held on the table 21 through the vacuum suction, for example.Since the outer peripheral section 14 of the resin film 13 is in theuncured state, the resin film 13 has its flowability. However, the resinfilm 13 is not dropped due to the action of the surface tension. One endthat becomes the starting point of the bonding of the flexible secondsubstrate (film) 12 is interposed and held with the holding means 41B1similar to that shown in FIG. 6 (the holding means is not shown in FIG.7). The height of the holding means 41B1 is adjusted so that when thesubstrate film 12 is held in a horizontal position, the substrate film12 is brought into contact with the resin film 13. The flexiblesubstrate film 12 is interposed and held with the holding means 41B1 soas to have a curved surface convex to the upper side. In thisEmbodiment, the other end of the substrate film 12 is spontaneouslydrooped down by gravity, and therefore the other end of the substratefilm 12 may not be held. Furthermore, the other end of the substratefilm 12 may be held by the holding means 41B2 as described above, andthe holding means 41B2 may be linked and moved with the rotation of theroller means 42.

The roller means 42 is pushed to the substrate film 12 from under side.Since the substrate film 12 is flexible, the substrate film 12 comesinto contact with the resin film 13 at the one end, but the substratefilm does not come into contact with the resin film 13 at the othersection and bends downward. One end of the outer peripheral section 14is determined as the starting point 16, and the roller means 42 movesfrom the starting point 16 to the opposite end while applying thepressing force. At this time, as the roller means 42 moves, thesubstrate film 12 is brought into contact while the boundary linebetween the contact portion and the noncontact portion moves in onedirection. Accordingly, the substrate 11 and the substrate film 12 arebonded together.

The other configurations and the process flow are the same as those inEmbodiment 1, and the same effects can be provided.

Embodiment 3

In Embodiment 3, an example in which the ultraviolet shielding means isused to maintain the outer peripheral section of the resin film in theuncured state, and the inner section is cured into the semi-cured stateand in which the first substrate (substrate) is mounted on the mountingmeans (table), the second substrate (substrate film) is held with theholding means and pressed gradually closer to the first substrate side,and the second substrate is bonded to the first substrate is described.

FIG. 8 shows a configuration example of the manufacturing apparatus 10Aof the bonded member in Embodiment 3. In comparison with Embodiment 1,although the contents of the substrate bonding means 40A are different,the other configurations are the same. Different points from Embodiment1 will be principally described. The processes of the substrate bondingmeans 40A should be referred to FIG. 9. The substrate bonding means 40Ahas a table 21 that the substrate 11 is mounted on (that can be commonlyused with the table of the resin film forming means 20), and the holdingmeans 41 that holds the substrate film 12, a rotating means 43 that iscoupled to the table 21 to rotate the holding means 41 about arotational shaft 43B, a rotational shaft position adjusting means 44that adjusts the position of the rotational shaft 43B with respect tothe table 21.

The controller 50 controls the rotating means 43 and the rotationalshaft position adjusting means 44 to allow the substrate film 12 to bebrought into contact with the resin film 13 in which the outerperipheral section 14 is maintained in the uncured state and the innersection 15 is cured into the semi-cured state such that one end of theouter peripheral section 14 is determined as the starting point 16, andthe boundary line between the contact portion and the noncontact portionmoves from the starting point 16 to the opposite end in one directionwhile the pressing force is applied, and the substrate film 12 is bondedto the first substrate 11.

The rotating means 43 has the rotational shaft 43B as a rotationalshaft, a driving part 43C that drives the rotation of the rotationalshaft 43B, the holding means 41 that is coupled to the rotational shaft43B, and a hinge part 43A that urges the mounting means 21 to an openside. The holding means 41 holds the substrate film 12 through thevacuum suction, for example. The rotational shaft position adjustingmeans 44 allows the position of the rotational shaft 43B to move by asmall distance in the vertical direction while the rotational shaft 43Bis maintained in parallel with the surface of the table 21. Thecontroller 50 controls the spacing between the mounting means 21 and theholding means 41 and also controls the rotating means 43. These controlsare conducted through the control of the rotation angle of the holdingmeans 41 by the driving part 43C of the rotating means 43, the controlof the position of the rotational shaft 43B by the rotational positionadjusting means 44, and the control of the position of the mountingmeans 21 for example. The driving part 43C and the rotational shaftposition adjusting means 44 are controlled such that the substrate film12 is brought into contact with the resin film 13 in which the outerperipheral section 14 is in the uncured state and the inner section 15is in the semi-cured state so that one end of the outer peripheralsection 14 is determined as the starting point 16, and the boundary linebetween the contact portion and the noncontact portion moves from thestarting point 16 to the opposite end in one direction while thepressing force is applied.

The substrate bonding means 40A holds the substrate film 12 with theholding means 41. The controller 50 controls the driving part 43C todecrease the angle between the horizontal plane of the substrate 11 andthe holding means 41 and contact to one end of the outer peripheralsection 14, and furthermore controls the rotational shaft positionadjusting means 44 to gradually raise the position of the rotationalshaft 43B. During the contact, the resin of the outer peripheral section14 contacts to the bulged portion, and the contact portion spreads fromthe outer peripheral side to the inner side. Then, the uncured portionthat is bulged moves toward the inner side and is eventually pressed onthe substrate film, and the thickness of the resin film becomes the samein the outer peripheral section 14 and the inner section 15.

Accordingly, one end of the outer peripheral section 14 is determined asthe starting point 16, the second substrate is brought into contact withthe resin film 13 on the first substrate 11 so that a boundary linebetween a contact portion and a noncontact portion moves from thestarting point 16 to the opposite end in one direction while thepressing force is applied on the substrate film 12. The contact portionof the resin film 13 gradually spreads and eventually reaches the outerperipheral section 14 opposite to the starting point 16. Because thereis the portion in the uncured state at that point, a part of the resinflows, but the substrate film 12 is uniformly pressed on the substrate11 through the resin film 13, and the flat interface is finally formedbetween the substrate film 12 and the resin film 13. The controller 50controls the rotational shaft position adjusting means 44 to graduallylower the position of the rotational shaft 43B at the pressing after theentire surface of the substrate film 12 contacts. When the holding means41 is released, the bonded member in which the substrate film 12 isbonded to the substrate 11 through the resin film 13 can be obtained.Then, the relative misalignment is absent between the substrates, andthe bonded member that has no or very small distortion (undulation) onthe surface of the substrate film 12 is formed.

The process flow in Embodiment 3 can adopt that in FIG. 2. Although thedetails of the substrate bonding process are different, the otherprocesses are the same.

FIG. 9 illustrates an example of the substrate bonding means 40A inEmbodiment 3. The substrate 11 on which the resin film 13 is formed ismounted on the table 21. The outer peripheral sections 14 at four sidesof the resin film 13 are in the uncured liquid state, and the innersection 15 is in the semi-cured state and its viscosity is increased.The substrate film 12 is held with the holding means 41 (a). Thesubstrate bonding means 40A is provided with the rotating means 43including a hinge part 43A, a rotational shaft 43B, and a driving part43C. In addition, in order to adjust the spacing at the bonding betweenthe substrate film 12 and the resin film 13 formed on the substrate 11,the rotational shaft position adjusting means 44 is provided to bedirectly coupled to the driving part 43C and adjusts the verticalposition of the rotational shaft 43B for rotating the holding means 41with respect to the table 21. As the rotational shaft position adjustingmeans 44, a link mechanism, a guide rail, and the like can be used. Themovement of the rotational shaft in the vertical direction is generallydriven by an electric motor, and preferably driven by a stepping(stepper) motor.

The controller 50 controls the driving part 43C and the rotational shaftposition adjusting means 44, and thereby controls the lifting positionof the holding means 41 (the angle of the rotation and the height of therotational shaft 43B). By rotating the rotational shaft 43B with thedriving part 43C, the holding means 41 is rotated through the hinge part43A, and the angle between the holding means 41 and the table 21gradually decreases from an opening state of 180° (b). The startingpoint 16 is determined on the outer peripheral section 14 that is theuncured region of the resin film 13 formed on the substrate 11, and thenthe substrate film 12 is brought into contact with the resin film 13.Accordingly, the substrate 11 and the substrate film 12 are combined andbonded with each other (c)(d).

FIG. 10 illustrates an appearance when the substrate film 12 comes intocontact with the resin film 13. The outer peripheral sections 14 at foursides of the resin film 13 on the substrate 11 are in the uncured liquidstate. When the substrate film 12 is brought into contact with thestarting point 16 of the outer peripheral section 14 that is the uncuredregion of the resin film 13 on the substrate 11, and the angle of theholding means 41 with respect to the table 21 is gradually decreased,the contact area between the substrate film 12 and the resin film 13gradually increases. Since the outer peripheral section 14 of the resinfilm 13 on the substrate 11 is in the uncured liquid state, air bubblesare hardly trapped at the moment when the substrate film 12 comes intocontact with liquid film of the resin film 13, and furthermore thesubstrate film 12 is gradually brought into contact with liquid on theresin film 13, and therefore the substrate film 12 can be bonded to thesubstrate 11 without trapping air bubbles between the substrate film 12and the resin film 13 in general.

Going back to FIG. 9, the description is continued. When the bonding isfinished, the holding means 41 is returned to the original position (e).

The rotational shaft position adjusting means 44 may be absent. However,the adjustment of the spacing between the substrate film 12 and thesubstrate 11 is facilitated when the rotational shaft position adjustingmeans 44 is provided. In addition, instead of controlling the height ofthe holding means 41 as described above, the position adjusting meansmay be provided to the table 21 to control the vertical position of thetable 21.

Furthermore, instead of providing the rotational shaft positionadjusting means 44, a bearing of the rotational shaft 43B may have play,and a spring may urge the rotational shaft toward the table 21 such thatthe position around the rotational shaft of the holding means 41 isvariable. When the bearing has play, the holding means 41 may be urgedtoward the table 21 with its own weight.

The other configurations and the process flow are the same as those inEmbodiment 1, and the same effects can be provided.

Embodiment 4

In Embodiment 3, the case where the holding means 41 has a flat surface,and in Embodiment 4, an example in which the holding means 41 has aconvex and curved surface. Because the holding means 41 has a curvedsurface, in the similar way to the roller means 42, the second substrate(film) can be brought into contact with the resin film 13 successivelyfrom the starting point 16 of the outer peripheral section 14 of theresin film 13. It can be said that this is a case where the diameter ofthe roller means is larger than that in Embodiment 1 (see FIG. 5). Whenthe diameter of the roller means is sufficiently large with respect tosize of the substrate, a part of an arc may be cut and the cut part maybe the holding means for example (that is, the holding means also servesas the roller means). In addition, the surface of the roller may not bean arc but may be the other convex and curved surface. The other deviceconfigurations and the process flow are the same as those in Embodiment3, and the same effects can be provided.

FIG. 11A, FIG. 11B and FIG. 11C illustrate an example in which theholding means 41 holds the substrate film 12 in a curved shape. Theholding means 41 holds the substrate film 12 in a holding part 41A inthe curved shape (convex surface). The holding means 41 has a holdingpart support plate 41B in an opposite side of the substrate 11 withrespect to the holding part 41A. The holding part support plate 41B isrotatably coupled to the rotational shaft 43B, and the opening anglewith the substrate 11 changes according to the rotation of therotational shaft 43B. First, the substrate film 12 is brought intocontact with the resin film 13 in a liquid state at one end of the outerperipheral section 14 as the starting point 16 (FIG. 11A). Next, therotational shaft 43B is rotated and moved to the right side of thedrawing, and the substrate film 12 is brought into contact with theliquid resin film 13 (FIG. 11B). Furthermore, the rotational shaft 43Bis rotated and moved to the right side of the drawing, and thus thesubstrate film 12 is brought into contact with the other end of theouter peripheral section 14 of the resin film 13, and the substrate film12 is bonded to the substrate 11 through the resin film 13 (FIG. 11C).

Accordingly, the boundary line between the contact portion and thenoncontact portion moves from the starting point 16 to the opposite endin one direction while the pressing force is applied, and thus therelative misalignment is absent between the substrates, the bondedmember that has no or very small distortion (undulation) on the surfaceof the substrate film 12 is formed, and the flat interface is formedbetween the substrate film 12 and the resin film 13.

The other configurations and the process flow are the same as those inEmbodiment 3, and the same effects can be provided.

Embodiment 5

In Embodiment 5, an example in which a voltage is applied to the holdingmeans 41 in Embodiment 3 is described. In Embodiment 5, a voltageapplication means 60 is added to the manufacturing apparatus 10A of thebonded member in Embodiment 3 (see FIG. 8). The voltage is appliedbetween the mounting means (table) 21 and the holding means 41. Theother configurations are the same as those in Embodiment 3.

FIG. 12 shows a configuration example of the manufacturing apparatus 10Bof the bonded member in Embodiment 5. In addition, FIG. 13 illustratesan example in which an electric field is applied between the firstsubstrate (substrate) 11 and the second substrate (film) 12. Adirect-current power supply 60 is connected to the holding means 41, andthe table 21 is connected to ground. When the electric field is formedbetween the substrate 11 and the substrate film 12, a front end of theresin film 13 on the substrate 11 is attracted to the substrate film 12,and therefore the substrate film 12 can be brought into contact with theresin film 13 with a small contact area. Thus, when the substrate film12 is brought into contact with the resin film 13, air bubbles arehardly trapped. As an alternative to the direct-current power supply 60,an alternating-current power supply or a pulsing voltage source can beconnected.

The other configurations and the process flow are the same as those inEmbodiment 3, and the same effects can be provided.

Embodiment 6

In Embodiment 1, the example in which the ultraviolet shielding means isused to maintain the outer peripheral section of the resin film in theuncured state and cure the inner section into the semi-cured state hasbeen described, and in Embodiment 6, as an another example of the lightblocking means, an example in which the ultraviolet irradiation meanshaving an ultraviolet irradiation slit integrally constructed with theslit coater is used to maintain the outer peripheral section of theresin film in the uncured state and cure the inner section into thesemi-cured state will be described. The ultraviolet irradiation meansand the slit coater are integrally constructed, and the construction isdifferent from Embodiment 1.

FIG. 14 shows a configuration example of the manufacturing apparatus 10Cof the bonded member in Embodiment 6. In addition, FIG. 15 illustratesan example in which the slit coater as the application means 22 and theultraviolet irradiation means 31C are integrally formed. The ultravioletirradiation means 31C having an ultraviolet irradiation slit is providedin parallel with the resin feeding slit of the slit coater as theapplication means 22. Along with the application of the liquid resin,the ultraviolet light is irradiated to the liquid resin to semi-cure theresin film 13. With respect to the resin feeding slit of the slit coater22, the length of the ultraviolet irradiation slit between both ends inthe longitudinal direction is formed shorter by a specified length thanthe length of the resin feeding slit in the longitudinal direction. Thespecified length is generally the width of the outer peripheral section14 at one end, and the sum at both ends is the double of the width ofthe outer peripheral section 14 in length. Furthermore, the scanningmeans 23 scans (moves) the slit coater 22 and the ultravioletirradiation means 31C that are integrated or combined, in the horizontalplane and in the perpendicular direction to the longitudinal directionof the both slits. By this scanning, on the surface of the firstsubstrate (substrate) 11, when a specified time elapses after the resinfilm 13 in the liquid state is linearly applied from the resin feedingslit with the slit coater 22, the ultraviolet light starts to belinearly irradiated from the ultraviolet irradiation slit. The specifiedtime is the time obtained from a calculation in which the spacingbetween the resin feeding slit and the ultraviolet irradiation slit plusthe width of the outer peripheral section 14 is divided by the scanningspeed.

At this time, the ultraviolet irradiation slit is shorter than the resinfeeding slit at both ends in the longitudinal direction, and thereforethe ultraviolet light is not irradiated at both ends (to be the outerperipheral sections 14) of the resin film 13 in the longitudinaldirection. Thus, the resin film 13 is formed in the uncured state atboth ends in the longitudinal direction (in the perpendicular directionto the scanning direction) and in the semi-cured state in the inside (tobe the inner section 15) of the both ends. Regarding the direction inparallel with the scanning direction, the ultraviolet irradiation isstarted and finished when the ultraviolet irradiation slit is positionedat a specified distance from the end of an application area, and thusthe area in the uncured state can be formed at the both ends of theresin film 13. The specified distance is typically the width of theouter peripheral section. In other words, the semi-curing of the resinfilm is conducted through the ultraviolet irradiation to only the innersection 15 and not to the outer peripheral sections 14 at four sides ofthe applied resin film. In this Embodiment, even though the ultravioletshielding means 32 is not provided, only the inner section 15 can besemi-cured and the outer peripheral sections 14 is not.

The other configurations and the process flow are the same as those inEmbodiment 1, and the same effects can be provided.

Embodiment 7

In Embodiment 7, an example in which the thickness of the firstsubstrate (substrate) 11 is measured in Embodiment 3 before the resinfilm 13 is formed on the substrate 11 by the slit coater is described.

FIG. 16 shows a configuration example of the manufacturing apparatus 10Dof the bonded member in Embodiment 7. Furthermore, FIG. 17 illustratesan example of measuring the thickness of the substrate 11. The thicknessof the substrate 11, that is, the height from the mounting means (table)21 to the surface of the substrate 11 is measured by a laserdisplacement gauge as a substrate thickness measuring means 70, and thethickness information of the substrate 11 as the result of themeasurement is input to the controller 50. The controller 50 outputs thecontrol signals for controlling the up-and-down movement of theapplication means 22, the substrate bonding means 40D, and/or the table21. Accordingly, the height of the resin feeding slit of the slit coater22 and the height of the holding means 41 of the substrate bonding means40D with respect to the surface of the substrate 11 are adjusted. Inother words, in the application means 22, the slit coater 22 or thetable 21 is moved up and down in order to adjust the spacing between thetip of the slit coater 22 as the application means and the substrate.The spacing between the tip of the slit coater 22 and the substrate 11is adjusted in accordance with the thickness of the resin film 13 to beapplied. Furthermore, in the substrate bonding means 40D, the holdingmeans 41 for holding the substrate film 12 or the table 21 for mountingthe substrate 11 is moved up and down in order to adjust the spacingbetween the substrate 11 and the substrate film 12. In addition, thespacing between the substrate 11 and the substrate film 12, that is, thespacing between the holding means 41 and the table 21 is adjusted inaccordance with the thickness of the resin film 13.

In the substrate bonding means 40D, the thickness of the substrate film12 is also measured in addition to the substrate 11, the spacing betweenthe substrate 11 and the substrate film 12 is adjusted, based on thethickness data of the substrate 11 and the substrate film 12, andtherefore more appropriate adjustment of the spacing can be achieved.The thickness of the second substrate may also be measured on the table21, for example. Here, it is understood that, when the substrate film 12and the substrate 11 are bonded by using the roller means 42 asdescribed in Embodiment 1 and Embodiment 2, the thickness information ofthe substrate film 12 and the substrate 11 measured by the thicknessmeasuring means 70 can also be utilized.

The other configurations and the process flow are the same as those inEmbodiment 1 and Embodiment 3, and the same effects can be provided.

Up to this point, although the present embodiments have been described,it is obvious that the present invention is not limited to theembodiments described above, but various modifications can be madewithout departing from the spirit of the present invention.

For example, in the above Embodiments, the example in which the secondsubstrate is the film-like thin substrate has been described, but thethin substrate is not limited to the film and may be a plate-likesubstrate. The second substrate is not limited to the thin substrate,and the present invention is applicable to a thick substrate. The firstsubstrate and the second substrate may be any substrates, and bothsubstrates may be exchanged and applied. The example using the slitcoater as the application means 22 of the resin in the liquid state hasbeen described, but the application may be conducted while a singlenozzle is scanned in two directions within the mounting surface of themounting means, and the scanning range described above may be decreasedby using multi-nozzles. As the ultraviolet irradiation means 31, theexample in which the entire first substrate 11 is irradiate and theexample in which the ultraviolet irradiation slit is scanned have beendescribed, but the ultraviolet lamp with a circular spot may be scannedin two directions within the mounting surface to irradiate.

In a baking furnace in which a line ultraviolet irradiation means isdisposed on a ceiling, a tray which the first substrate 11 in which theresin film 13 is applied and the shielding means 32 are mounted on maybe placed on a belt conveyer and pass. In Embodiment 3, the example inwhich the substrate bonding means 40 rotates the holding means 41 hasbeen described in combination with the example in which the applicationmeans 22 is an independent slit coater and the ultraviolet irradiationmeans 31 irradiates the substrate 11 in combination with the shieldingmeans 32, but Embodiment 5 in which the slit coater and the ultravioletirradiation means are integrally formed may be combined. In Embodiment5, the example in which the voltages are applied between the substratesmay similarly be combined with Embodiment 6 in which the slit coater andthe ultraviolet irradiation means are integrally formed. In Embodiment7, the example in which the thickness of the first substrate 11 ismeasured in advance has been described in combination with the examplein which the substrate bonding means 40 rotates the holding means 41,but the example in which the substrate bonding means 40 uses the rollermeans 42 may be combined to use in the adjustment of the height of theroller along with the height of the resin feeding slit. Other thingssuch as the viscosity of the liquid resin, time and intensity of theultraviolet irradiation, pressing force of the roller at the bonding canbe selected appropriately.

INDUSTRIAL APPLICABILITY

The present invention is used to the production of the bonded member.

DESCRIPTION OF REFERENCE NUMERALS AND SYMBOLS

-   10, 10A-10D manufacturing apparatus of bonded member-   11, 11E first substrate (liquid crystal panel)-   12, 12E second substrate (substrate film)-   13, 13E resin film (bonding agent)-   14 outer peripheral section-   15 inner section-   17 starting point-   17E cutout section-   20 resin film forming means-   21 mounting means (table)-   22 application means (slit coater)-   23 scanning means-   30 semi-curing means-   31, 31E ultraviolet irradiation means-   32 light blocking means (shielding means)-   40, 40A-40D substrate bonding means-   41, 41B1, 41B2, 41E holding means-   41A holding part-   41B holding part support plate-   42 roller means-   43 rotating means-   43A hinge part-   43B rotational shaft-   43C driving part-   44 rotational shaft position adjusting means-   50 controller-   51 application means driving part-   60 direct-current power supply-   70 substrate thickness measuring means (laser displacement gauge)

The use of the terms “a” and “an” and “the” and similar referents in thecontext of describing the invention (especially in the context of thefollowing claims) is to be construed to cover both the singular and theplural, unless otherwise indicated herein or clearly contradicted bycontext. The terms “comprising,” “having,” “including,” and “containing”are to be construed as open-ended terms (i.e., meaning “including, butnot limited to,”) unless otherwise noted. Recitation of ranges of valuesherein are merely intended to serve as a shorthand method of referringindividually to each separate value falling within the range, unlessotherwise indicated herein, and each separate value is incorporated intothe specification as if it were individually recited herein. All methodsdescribed herein can be performed in any suitable order unless otherwiseindicated herein or otherwise clearly contradicted by context. The useof any and all examples, or exemplary language (e.g., “such as”)provided herein, is intended merely to better illuminate the inventionand does not pose a limitation on the scope of the invention unlessotherwise claimed. No language in the specification should be construedas indicating any non-claimed element as essential to the practice ofthe invention.

Preferred embodiments of this invention are described herein, includingthe best mode known to the inventors for carrying out the invention.Variations of those preferred embodiments may become apparent to thoseof ordinary skill in the art upon reading the foregoing description. Theinventors expect skilled artisans to employ such variations asappropriate, and the inventors intend for the invention to be practicedotherwise than as specifically described herein. Accordingly, thisinvention includes all modifications and equivalents of the subjectmatter recited in the claims appended hereto as permitted by applicablelaw. Moreover, any combination of the above-described elements in allpossible variations thereof is encompassed by the invention unlessotherwise indicated herein or otherwise clearly contradicted by context.

1-11. (canceled)
 12. A bonded member manufacturing method comprising: aresin film forming step of forming a liquid state resin film on thefirst substrate; a semi-curing step of maintaining an outer peripheralsection of the resin film formed through the resin film forming step inan uncured state and curing an inner section surrounded by the outerperipheral section in a semi-cured state; and a substrate bonding stepof bonding the first substrate and the second substrate together bybringing the second substrate into contact with the resin film whereinthe outer peripheral section is in the uncured state and the innersection is in the semi-cured state, such that one end of the outerperipheral section is determined as a starting point of the contact sothat a boundary line between a contact portion and a noncontact portionmoves in one direction from the starting point to an opposite end of theouter peripheral section while applying pressing force to the secondsubstrate, the contact portion being already contacted and thenoncontact portion being not yet contacted in bringing the secondsubstrate into contact with the resin film.
 13. The manufacturing methodaccording to claim 12, wherein the semi-curing step has an ultravioletirradiation step of irradiating ultraviolet light to cure the resinfilm, and a light blocking step of blocking the ultraviolet light to beirradiated by the ultraviolet irradiation step to the outer peripheralsection of the resin film formed through the resin film forming step.14. The manufacturing method according to claim 12, wherein the secondsubstrate is a transparent polymer film, and in the substrate bondingstep, the second substrate is pressed toward the first substrate with aroller means, the roller means is rolled from the one end side to theother end side of the outer peripheral section, and thereby the firstsubstrate is bonded to the second substrate.
 15. The manufacturingmethod according to claim 13, wherein the second substrate is atransparent polymer film, and in the substrate bonding step, the secondsubstrate is pressed toward the first substrate with a roller means, theroller means is rolled from the one end side to the other end side ofthe outer peripheral section, and thereby the first substrate is bondedto the second substrate.
 16. The manufacturing method according to claim12, wherein in the substrate bonding step, a mounting means for mountingthe first substrate thereon, a holding means for holding the secondsubstrate, and a rotating means for rotating the holding means, therotating means being coupled with the holding means are used, thesubstrate bonding step includes a step of controlling the spacingbetween the mounting means and the holding means and also controllingthe rotating means to allow the second substrate held with the holdingmeans to be brought into contact with the resin film wherein the outerperipheral section is maintained in the uncured state and the innersection is cured into the semi-cured state such that one end of theouter peripheral section is determined as the starting point of thecontact so that the boundary line between a contact portion and anoncontact portion moves in one direction from the starting point to anopposite end of the outer peripheral section while applying pressingforce to the second substrate, the contact portion being alreadycontacted and the noncontact portion being not yet contacted in aprocess of bringing the second substrate into contact with the resinfilm.
 17. The manufacturing method according to claim 13, wherein in thesubstrate bonding step, a mounting means for mounting the firstsubstrate thereon, a holding means for holding the second substrate, anda rotating means for rotating the holding means, the rotating meansbeing coupled with the holding means are used, the substrate bondingstep includes a step of controlling the spacing between the mountingmeans and the holding means and also controlling the rotating means toallow the second substrate held with the holding means to be broughtinto contact with the resin film wherein the outer peripheral section ismaintained in the uncured state and the inner section is determined asthe starting point of the contact so that the boundary line between acontact portion and a noncontact portion moves in one direction from thestarting point to an opposite end of the outer peripheral section whileapplying pressing force to the second substrate, the contact portionbeing already contacted and the noncontact portion being not yetcontacted in a process of bringing the second substrate into contactwith the resin film.